International Engineering Consortium's Euro Designcon 2004 To Feature An Impressive Array Of Technology Exhibitors

Euro DesignCon 2004, taking place 11-14 October 2004 at the Arabella Sheraton Grand Hotel in Munich, Germany, will feature exhibits from leading companies in the electronic design and semiconductor industries. Attendees will see exclusive firsthand demonstrations of the latest technologies from the foremost companies in the design field.

Exhibitors include EDA tool providers, ASIC, IC, FPGA and test and measurement components vendors, intellectual property (IP) providers, PCB tool providers, and system OEMs. The exhibition layout and educational format at Euro DesignCon allows for peer-to-peer exchange on leading-edge design methodologies, tools, and solutions.

"Euro DesignCon allows for first-class peer-to-peer exchange on leading edge design methodologies, tools, and solutions," said Dima Smolyansky, product marketing manager for TDA Systems. "It's a very focused show with the brightest minds and most experienced teams of designers participating. We are proud to exhibit and support Euro DesignCon."

"As with the U.S. DesignCon events, we want to provide a learning environment and offer attendees an opportunity to meet and discuss their design challenges with EDA and semiconductor tool vendors. We have exceeded our exhibitor expectations for this first European show and are pleased to offer such an array of leading vendors," stated John Janowiak, Senior Director of the IEC.


Based on the International Engineering Consortium’s (IEC) highly successful DesignCon program in the U.S., the Euro DesignCon technology exhibition addresses current issues that are most significant to the European semiconductor and electronic design communities. In addition to the exhibition, the event will offer a comprehensive educational program of keynote addresses, plenary and technical panels, technical paper presentations and Technical Forums.

Registration and program information for Euro DesignCon can be found at http://www.designcon.com/euro.

Exhibitors include Agilent Technologies, Ansoft, Celoxica, Bayern Innovativ, CST, EDACentrum, ERNI, FCI Connectors, IC Mask Design, Infineon Technologies, Interconnect Technologies – A Division of Northrop Grumman, LSI Logic, Molex, Novas Software, nSys, Sigrity, SyntheSys Research, TDA Systems, Teradyne, TeraSystems, Texas Instruments, Tyco, and Wavecrest.

About DesignCon Events (http://www.designcon.com) DesignCon, DesignCon East, and Euro DesignCon conference programs provide education and updates on the latest technology advances affecting design engineers working at the chip, board, and system levels. The DesignCon technology exhibition delivers practical approaches, techniques, and procedures directly on the show floor, where leading-edge displays from key organizations offer proven solutions for immediate application.

About the IEC (http://www.iec.org) The International Engineering Consortium (IEC) is a nonprofit organization dedicated to catalyzing technology and business progress worldwide in a range of high-technology industries and their university communities. Since 1944, the IEC has provided high-quality educational opportunities for industry professionals, academics, and students. In conjunction with industry-leading companies, the IEC has developed an extensive free on-line educational program. The IEC conducts industry-university programs that have substantial impact on curricula. It also conducts research and develops publications, conferences, and technological exhibits that address major opportunities and challenges of the information age. More than 70 leading high-technology universities are IEC affiliates, and the IEC handles the affairs of the Electrical and Computer Engineering Department Heads Association.



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